半导体器件制造 semiconductor device fabrication; semiconductor fabrication 半导体器件综合 semiconductor devices in general ..
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The process variation accounts for deviations in the semiconductor fabrication process.
工艺参数的变异导致半导体制造过程的偏差。
The gate length may be larger than the minimum specified by semiconductor fabrication design rules.
栅极长度可以比半导体制造设计规则所指定的最小值大。
After an analysis of the process of semiconductor fabrication, a proposal of the wafer dicing using micro-abrasive waterjet is put forward.
通过对半导体加工工艺的分析研究,提出了用磨料水射流切割半导体材料,包括晶圆的切割、芯片的终端封装切割。
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